Pressure Oven for Semiconductor Manufacturing

Availability:

1 in stock


Pressure oven provides a constant pressure and temperature.

It removes voids when hardening epoxy or underfill solution.
Is used in film bonding process.

Key Feature
– Temperature : Max. 220°C
– Temperature Accuracy : +/- 0.3°C
– Temperature Uniformity : +/- 3°Cat 175°C
– Max. Pressure : 10 kg/cm2
-Pressure Stability : Within +/- 0.1 kg/cm2
– High Productivity
– PM Calibration Point : Multi points temp
– Stainless Steel Chamber
– Multi Safety Device for Temperature and Pressure

SKU: YLINE SPO220 Pressure Oven Category: Tags: ,