WFLO Hotplate Oven for Semiconductor Manufacturing

Availability:

1 in stock


Hotplate oven is used for passivation curing of wafers in teh semiconductor bumping process.

Key Feature
– Temperature : Max. 280°C
– Temperature Accuracy : +/- 0.1°C
– Temperature Uniformity : +/- 1.25°C at 230°C
– Wafer Loading : 8″ & 12″
– Sensor Array 12 point Tested
– Ramp up time : R.T to 250°C within 25min
(Temp. Rise : 10°C/min)
– Cooling Type : Water Cooling
– O2 Analyzer : 30ppm (within 15min)
– Flatness : Max. 300μm (at. 280°C)

SKU: YLINE WLFPHPO280WC Category: Tags: ,